About the role
1. Detailed Should‑Cost Model Development
- Develop end‑to‑end should‑cost models for:
- Display modules (OLED, LTPO, LCD, AMOLED)
- Camera Modules
- Electronic modules (sensor + PCB assemblies, FP modules, camera modules)
- Mechanical & electro‑mechanical parts (plastic, die‑cast, machined, stamped)
- Prepare operation‑wise, process‑wise, and component‑wise costing, including:
- Raw material & purchased parts (BOM / BOP)
- Conversion & process costs
- Yield loss, scrap, and rework provisions
- Assembly, testing, inspection, and calibration
- Packing, logistics, ICC, overheads, SG&A, and margin build‑up
Manufacturing Process Costing Expertise
Ability to cost and validate the following processes (depending on domain):
Electronics & Displays
- LTPO / LTPS / IGZO backplane processing
- Camera modules
- OLED RGB deposition (VTE, FMM)
- Thin Film Encapsulation (TFE – inorganic/organic stacks)
- Touch & sensor integration
- COF/ACF bonding, DDIC integration
- Cleanroom lamination (OCA / LOCA)
- Final electrical & optical testing
Electronics Manufacturing
- SMT process costing (placement rate, line balance, yields)
- PCB/FPC fabrication costing (2‑layer to HDI, ENIG/OSP)
- Sensor module assembly and testing
- EMS margin & overhead structures
Qualifications: BACHELOR OF ENGINEERING