About the role
Responsibilities
- Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages
- Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;
- To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing & FA Approvals
- To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements
- Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis.
- Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups
- Uphold the company’s core values of Integrity, Innovation, Accountability, and Teamwork
- Demonstrate behavior consistent with the company’s Code of Ethics and Conduct
- It is the responsibility of every employee to report to their manager or a member of senior management any quality problems or defects in order for corrective action to be implemented and to avoid recurrence of the problem.
Qualifications
- 10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach , wire bond and encapsulation .
- Programming skills with automatic epoxy machines, Optical measurement systems desirable.
- Working knowledge of FMEA , Six Sigma and statistical analysis using Minitab etc;
- To interpretate mechanical drawings . Experience preferred to generate drawings in Solid works , Autocad drawings , Programming vision based measurement systems and process equipment.